Compensated Location Specific Processing Apparatus And Method

    公开(公告)号:US20200066485A1

    公开(公告)日:2020-02-27

    申请号:US16665357

    申请日:2019-10-28

    申请人: TEL Epion Inc.

    摘要: An apparatus and method for processing a workpiece with a beam is described. The apparatus includes a vacuum chamber having a beam-line for forming a particle beam and treating a workpiece with the particle beam, and a scanner for translating the workpiece through the particle beam. The apparatus further includes a scanner control circuit coupled to the scanner, and configured to control a scan property of the scanner, and a beam control circuit coupled to at least one beam-line component, and configured to control the beam flux of the particle beam according to a duty cycle for switching between at least two different states during processing.

    COMPENSATED LOCATION SPECIFIC PROCESSING APPARATUS AND METHOD

    公开(公告)号:US20180197715A1

    公开(公告)日:2018-07-12

    申请号:US15863732

    申请日:2018-01-05

    申请人: TEL Epion Inc.

    摘要: An apparatus and method for processing a workpiece with a beam is described. The apparatus includes a vacuum chamber having a beam-line for forming a particle beam and treating a workpiece with the particle beam, and a scanner for translating the workpiece through the particle beam. The apparatus further includes a scanner control circuit coupled to the scanner, and configured to control a scan property of the scanner, and a beam control circuit coupled to at least one beam-line component, and configured to control the beam flux of the particle beam according to a duty cycle for switching between at least two different states during processing.

    PROCESS GAS ENHANCEMENT FOR BEAM TREATMENT OF A SUBSTRATE
    3.
    发明申请
    PROCESS GAS ENHANCEMENT FOR BEAM TREATMENT OF A SUBSTRATE 有权
    用于处理基材的处理气体增强

    公开(公告)号:US20160071734A1

    公开(公告)日:2016-03-10

    申请号:US14842416

    申请日:2015-09-01

    申请人: TEL Epion Inc.

    摘要: A beam processing system and method of operating are described. In particular, the beam processing system includes a beam source having a nozzle assembly that is configured to introduce a primary gas through the nozzle assembly to a vacuum vessel in order to produce a gaseous beam, such as a gas cluster beam, and optionally, an ionizer positioned downstream from the nozzle assembly, and configured to ionize the gaseous beam to produce an ionized gaseous beam. The beam processing system further includes a process chamber within which a substrate is positioned for treatment by the gaseous beam, and a secondary gas source, wherein the secondary gas source includes a secondary gas supply system that delivers a secondary gas, and a secondary gas controller that operatively controls the flow of the secondary gas injected into the beam processing system downstream of the nozzle assembly.

    摘要翻译: 描述了一种光束处理系统和操作方法。 特别地,光束处理系统包括具有喷嘴组件的光束源,喷嘴组件被配置为将初级气体通过喷嘴组件引入真空容器,以便产生诸如气体束束的气体束,并且可选地, 定位在喷嘴组件下游的离子发生器,并被配置为离子化气体束以产生离子化的气体束。 光束处理系统还包括处理室,其中定位用于由气体束进行处理的基板和二次气体源,其中二次气体源包括输送二次气体的二次气体供应系统和二次气体控制器 其可操作地控制注入喷嘴组件下游的光束处理系统中的二次气体的流动。

    Compensated location specific processing apparatus and method

    公开(公告)号:US10861674B2

    公开(公告)日:2020-12-08

    申请号:US16665357

    申请日:2019-10-28

    申请人: TEL Epion Inc.

    摘要: An apparatus and method for processing a workpiece with a beam is described. The apparatus includes a vacuum chamber having a beam-line for forming a particle beam and treating a workpiece with the particle beam, and a scanner for translating the workpiece through the particle beam. The apparatus further includes a scanner control circuit coupled to the scanner, and configured to control a scan property of the scanner, and a beam control circuit coupled to at least one beam-line component, and configured to control the beam flux of the particle beam according to a duty cycle for switching between at least two different states during processing.