Invention Grant
- Patent Title: Substrate processing device and substrate processing method
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Application No.: US14212899Application Date: 2014-03-14
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Publication No.: US10276406B2Publication Date: 2019-04-30
- Inventor: Konosuke Hayashi , Masaaki Furuya , Takashi Ootagaki , Yuji Nagashima , Atsushi Kinase , Masahiro Abe
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi, Kanagawa
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Yokohama-shi, Kanagawa
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-054559 20130318; JP2014-028998 20140218
- Main IPC: B08B3/10
- IPC: B08B3/10 ; H01L21/67
Abstract:
A substrate processing device includes a suction drying section drying a surface of a substrate by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate by a heating operation of a heating section.
Public/Granted literature
- US20140261566A1 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD Public/Granted day:2014-09-18
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