- 专利标题: Substrate processing apparatus and substrate processing method
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申请号: US14773055申请日: 2014-02-28
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公开(公告)号: US10281210B2公开(公告)日: 2019-05-07
- 发明人: Kunihiro Miyazaki , Konosuke Hayashi , Takashi Ootagaki , Yuji Nagashima
- 申请人: SHIBAURA MECHATRONICS CORPORATION
- 申请人地址: JP Yokohama-shi
- 专利权人: SHIBAURA MECHATRONICS CORPORATION
- 当前专利权人: SHIBAURA MECHATRONICS CORPORATION
- 当前专利权人地址: JP Yokohama-shi
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2013-045532 20130307; JP2013-140416 20130704; JP2014-028314 20140218
- 国际申请: PCT/JP2014/055054 WO 20140228
- 国际公布: WO2014/136670 WO 20140912
- 主分类号: F26B3/30
- IPC分类号: F26B3/30 ; F26B7/00 ; F26B11/18 ; F26B3/28 ; H01L21/02 ; H01L21/67 ; F26B5/00
摘要:
According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.
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