Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US14773055Application Date: 2014-02-28
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Publication No.: US10281210B2Publication Date: 2019-05-07
- Inventor: Kunihiro Miyazaki , Konosuke Hayashi , Takashi Ootagaki , Yuji Nagashima
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-045532 20130307; JP2013-140416 20130704; JP2014-028314 20140218
- International Application: PCT/JP2014/055054 WO 20140228
- International Announcement: WO2014/136670 WO 20140912
- Main IPC: F26B3/30
- IPC: F26B3/30 ; F26B7/00 ; F26B11/18 ; F26B3/28 ; H01L21/02 ; H01L21/67 ; F26B5/00

Abstract:
According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.
Public/Granted literature
- US20160025409A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2016-01-28
Information query
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