Invention Grant
- Patent Title: Power module having control substrate mounted above power substrate with control substrate drivers located between the power substrate power transistors
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Application No.: US15891872Application Date: 2018-02-08
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Publication No.: US10284109B2Publication Date: 2019-05-07
- Inventor: Koji Bando , Kuniharu Muto , Hideaki Sato
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2017-027815 20170217
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H02M7/48 ; H02M7/00 ; H03K17/64 ; H01L25/18 ; H01L23/12
Abstract:
An electronic device includes a first substrate, a wiring substrate (second substrate) disposed over the first substrate, and an enclosure (case) in which the first substrate and the wiring substrate are accommodated and that has a first side and a second side. A driver component (semiconductor component) is mounted on the wiring substrate. A gate electrode of a first semiconductor component is electrically connected to the driver component via a lead disposed on a side of the first side and a wiring disposed between the driver component and the first side. A gate electrode of a second semiconductor component is electrically connected to the driver component via a lead disposed on a side of the second side and a wiring disposed between the driver component and the second side.
Public/Granted literature
- US20180241319A1 ELECTRONIC DEVICE Public/Granted day:2018-08-23
Information query
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