公开(公告)号：US10361174B2

公开(公告)日：2019-07-23

申请号：US16035152

申请日：2018-07-13

Applicant: Renesas Electronics Corporation

Inventor： Koji Bando ,  Tomohiro Nishiyama

IPC: H01L23/52 ,  H01L25/065 ,  H01L23/367 ,  H01L23/31 ,  H01L23/538

Abstract: An improvement is achieved in the heat dissipation property of an electronic device including power transistors. A semiconductor module includes first and second packages included in an inverter circuit. In the first package, a semiconductor chip having a high-side power transistor is embedded. In the second package, a semiconductor chip having a low-side power transistor is embedded. At the both wide surfaces of the first and second packages, first metal electrodes electrically coupled to respective collector electrodes of the power transistors and second metal electrodes electrically coupled to respective emitter electrodes of the power transistors are exposed. To the first and second metal electrodes of the first and second packages, four respective bus bar plates having areas larger than those of the first and second metal electrodes are joined.

公开(公告)号：US10566258B2

公开(公告)日：2020-02-18

申请号：US15969897

申请日：2018-05-03

Applicant: Renesas Electronics Corporation

Inventor： Kuniharu Muto ,  Koji Bando

IPC: H01L23/31 ,  H01L23/495 ,  H01L25/16 ,  H01L25/00 ,  H01L21/48 ,  H01L23/40 ,  H01L23/00 ,  H01L25/07 ,  H01L23/36 ,  H01L25/18 ,  H01L21/56 ,  H01L23/29

Abstract: Reliability of a semiconductor module is improved. In a resin mold step of assembly of a semiconductor module, an IGBT chip, a diode chip, a control chip, a part of each of chip mounting portions are resin molded so that a back surface of each of the chip mounting portions is exposed from a back surface of a sealing body. After the resin molding, an insulating layer is bonded to the back surface of the sealing body so as to cover each back surface (exposed portion) of the chip mounting portions, and then, a TIM layer is bonded to an insulating layer. Here, a region of the TIM layer in a plan view is included in a region of the insulating layer.

公开(公告)号：US10177110B2

公开(公告)日：2019-01-08

申请号：US16034102

申请日：2018-07-12

Applicant: Renesas Electronics Corporation

Inventor： Koji Bando

IPC: H01L23/12 ,  H01L23/053 ,  H01L23/00 ,  H01L23/31 ,  H01L23/40 ,  H01L23/04 ,  H01L23/373 ,  H01L25/07

Abstract: An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate.

公开(公告)号：US10050007B2

公开(公告)日：2018-08-14

申请号：US15721904

申请日：2017-09-30

Applicant: Renesas Electronics Corporation

Inventor： Koji Bando

IPC: H01L23/12 ,  H01L23/053 ,  H01L23/00 ,  H01L23/31 ,  H01L23/40

Abstract: An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate.

公开(公告)号：US09641102B2

公开(公告)日：2017-05-02

申请号：US14941721

申请日：2015-11-16

Applicant: Renesas Electronics Corporation

Inventor： Kazuhiro Mitamura ,  Koji Bando ,  Yukihiro Sato ,  Takamitsu Kanazawa

IPC: H02M7/537 ,  H01L27/06 ,  H01L29/739 ,  H01L29/861 ,  H01L23/31 ,  H01L23/495 ,  H02M7/00 ,  H02P27/06 ,  H01L23/00

CPC classification number: H02M7/537 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/0664 ,  H01L29/0615 ,  H01L29/0619 ,  H01L29/7397 ,  H01L29/861 ,  H01L29/8611 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/0781 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H02M7/003 ,  H02P27/06 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014

Abstract: For example, a semiconductor device has a lead connected to a second portion of a chip mounting part on which a semiconductor chip to be a heat source is mounted and a lead connected to a third portion of the chip mounting part on which the semiconductor chip to be the heat source is mounted. Further, each of the leads has a protruding portion protruding from a sealing member. In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device.

公开(公告)号：US11037847B2

公开(公告)日：2021-06-15

申请号：US16736052

申请日：2020-01-07

Applicant: Renesas Electronics Corporation

Inventor： Kuniharu Muto ,  Koji Bando

IPC: H01L23/31 ,  H01L23/495 ,  H01L25/16 ,  H01L25/00 ,  H01L21/48 ,  H01L23/40 ,  H01L23/00 ,  H01L25/07 ,  H01L23/36 ,  H01L25/18 ,  H01L21/56 ,  H01L23/29

Abstract: Reliability of a semiconductor module is improved. In a resin mold step of assembly of a semiconductor module, an IGBT chip, a diode chip, a control chip, a part of each of chip mounting portions are resin molded so that a back surface of each of the chip mounting portions is exposed from a back surface of a sealing body. After the resin molding, an insulating layer is bonded to the back surface of the sealing body so as to cover each back surface (exposed portion) of the chip mounting portions, and then, a TIM layer is bonded to an insulating layer. Here, a region of the TIM layer in a plan view is included in a region of the insulating layer.

公开(公告)号：US10056309B2

公开(公告)日：2018-08-21

申请号：US15655617

申请日：2017-07-20

Applicant: Renesas Electronics Corporation

Inventor： Koji Bando ,  Akira Muto

IPC: H01L23/053 ,  H01L23/057 ,  H01L23/495 ,  H01L23/50 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L23/433 ,  H01L25/11 ,  H02M7/00 ,  H01L23/31 ,  H01L29/739 ,  H01L29/78 ,  H01L29/861 ,  H01L23/373

Abstract: Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.

公开(公告)号：US09530723B2

公开(公告)日：2016-12-27

申请号：US14862102

申请日：2015-09-22

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Koji Bando ,  Yukihiro Sato ,  Kazuhiro Mitamura

IPC: H01L23/495 ,  H01L23/00 ,  B60L3/00 ,  B60L11/18 ,  B60L15/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/544

CPC classification number: H01L23/49575 ,  B60L3/003 ,  B60L11/1803 ,  B60L15/007 ,  B60L2220/12 ,  B60L2240/525 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49565 ,  H01L23/544 ,  H01L23/564 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/29116 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/40998 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/77704 ,  H01L2224/78704 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84136 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8485 ,  H01L2224/84862 ,  H01L2224/8585 ,  H01L2224/92147 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  Y02T10/645 ,  Y02T10/7005 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05559 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

Abstract translation: 假设在引线框架中设置一对悬挂部件，并且夹子包括主体部分和一对延伸部分，所述一对延伸部分被安装并支撑在所述一对悬挂部分上。 因此，夹子安装在一个引线（一点）上，一对悬挂部分（两点）和夹子被三个点支撑。

公开(公告)号：US10284109B2

公开(公告)日：2019-05-07

申请号：US15891872

申请日：2018-02-08

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Koji Bando ,  Kuniharu Muto ,  Hideaki Sato

IPC: H01L25/16 ,  H02M7/48 ,  H02M7/00 ,  H03K17/64 ,  H01L25/18 ,  H01L23/12

Abstract: An electronic device includes a first substrate, a wiring substrate (second substrate) disposed over the first substrate, and an enclosure (case) in which the first substrate and the wiring substrate are accommodated and that has a first side and a second side. A driver component (semiconductor component) is mounted on the wiring substrate. A gate electrode of a first semiconductor component is electrically connected to the driver component via a lead disposed on a side of the first side and a wiring disposed between the driver component and the first side. A gate electrode of a second semiconductor component is electrically connected to the driver component via a lead disposed on a side of the second side and a wiring disposed between the driver component and the second side.

公开(公告)号：US10141248B2

公开(公告)日：2018-11-27

申请号：US15385637

申请日：2016-12-20

Applicant: Renesas Electronics Corporation

Inventor： Akira Muto ,  Koji Bando ,  Yukihiro Sato ,  Kazuhiro Mitamura

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/544 ,  H01L23/31

Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.