Invention Grant
- Patent Title: PoP device and method of forming the same
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Application No.: US15688893Application Date: 2017-08-29
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Publication No.: US10290610B2Publication Date: 2019-05-14
- Inventor: Li-Hsien Huang , An-Jhih Su , Der-Chyang Yeh , Hua-Wei Tseng , Li-Hui Cheng , Po-Hao Tsai , Wei-Yu Chen , Ming-Shih Yeh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L25/065 ; H01L21/56 ; H01L23/31 ; H01L21/768 ; H01L25/00 ; H01L23/522 ; H01L23/498
Abstract:
A PoP device includes a first package structure, a second package structure and an underfill layer is provided. The first package structure includes a die, a TIV and an encapsulant. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and a portion of sidewalls of the TIV. The second package structure is connected to the first package structure through a connector. The underfill layer is disposed to fill a space between the first package structure and the second package structure. A portion of the underfill layer is disposed between the encapsulant and the TIV to cover a portion of sidewalls of the TIV.
Public/Granted literature
- US20190067249A1 POP DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2019-02-28
Information query
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