Invention Grant
- Patent Title: Semiconductor devices with layers commonly contacting fins and methods of manufacturing the same
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Application No.: US15351739Application Date: 2016-11-15
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Publication No.: US10297601B2Publication Date: 2019-05-21
- Inventor: Jin-Bum Kim , Myung-Gil Kang , Kang-Hun Moon , Cho-Eun Lee , Su-Jin Jung , Min-Hee Choi , Yang Xu , Dong-Suk Shin , Kwan-Heum Lee , Hoi-Sung Chung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2015-0163323 20151120
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L29/66 ; H01L29/78 ; H01L23/528 ; H01L27/088 ; H01L29/08 ; H01L29/161 ; H01L29/45 ; H01L23/485 ; H01L21/8234 ; H01L29/417 ; H01L27/092 ; H01L29/165

Abstract:
A semiconductor device may include a first active fin, a plurality of second active fins, a first source/drain layer structure, and a second source/drain layer structure. The first active fin may be on a first region of a substrate. The second active fins may be on a second region of the substrate. The first and second gate structures may be on the first and second active fins, respectively. The first source/drain layer structure may be on a portion of the first active fin that is adjacent to the first gate structure. The second source/drain layer structure may commonly contact upper surfaces of the second active fins adjacent to the second gate structure. A top surface of the second source/drain layer structure may be further from the surface of the substrate than a top surface of the first source/drain layer structure is to the surface of the substrate.
Public/Granted literature
- US20170148797A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2017-05-25
Information query
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