Invention Grant
- Patent Title: Triple gate technology for 14 nanometer and onwards
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Application No.: US15649227Application Date: 2017-07-13
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Publication No.: US10297672B2Publication Date: 2019-05-21
- Inventor: Seong Yeol Mun , Kwan-Yong Lim , Kijik Lee
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/51 ; H01L27/088 ; H01L21/28 ; H01L21/02 ; H01L29/49

Abstract:
A method of forming a 14 nm triple gate by adding a MG in the dual gate process and the resulting device are provided. Embodiments include forming an EG region, a MG region and a SG region in a first, second and third portions of a Si substrate, respectively; forming an IL over the EG, MG and SG regions; oxidizing the IL; forming a HK dielectric layer over the IL; performing PDA on the HK dielectric layer; forming a PSA TiN layer over the HK dielectric layer; forming an a-Si cap layer over the PSA TiN layer; forming a photoresist over the a-Si cap layer in the EG and SG regions; removing the a-Si cap layer in the MG region, exposing the PSA TiN layer; stripping the photoresist; and annealing the a-Si cap and PSA TiN layers.
Public/Granted literature
- US20190019880A1 TRIPLE GATE TECHNOLOGY FOR 14 NANOMETER AND ONWARDS Public/Granted day:2019-01-17
Information query
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