Invention Grant
- Patent Title: Manufacturing method of circuit substrate and mask structure and manufacturing method thereof
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Application No.: US15256757Application Date: 2016-09-06
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Publication No.: US10324370B2Publication Date: 2019-06-18
- Inventor: Pu-Ju Lin , Shih-Lian Cheng , Yu-Hua Chen , Cheng-Ta Ko , Jui-Jung Chien , Wei-Tse Ho
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Main IPC: H05K3/00
- IPC: H05K3/00 ; G03F1/50 ; H05K3/06 ; H05K3/24 ; G01K7/24 ; G01K15/00 ; H05K3/10 ; H05K3/12 ; H05K3/18 ; H05K3/42 ; G03F7/20
Abstract:
A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.
Public/Granted literature
- US20180070452A1 MANUFACTURING METHOD OF CIRCUIT SUBSTRATE AND MASK STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-08
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