- 专利标题： Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
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申请号： US15218466申请日： 2016-07-25
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公开(公告)号： US10332756B2公开(公告)日： 2019-06-25
- 发明人: Terumasa Moriyama , Tomota Nagaura
- 申请人： JX Nippon Mining & Metals Corporation
- 申请人地址： JP Tokyo
- 专利权人： JX Nippon Mining & Metals Corporation
- 当前专利权人： JX Nippon Mining & Metals Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Nields, Lemack & Frame, LLC
- 优先权： JP2015-148174 20150727; JP2016-027039 20160216
- 主分类号： B21C37/00
- IPC分类号： B21C37/00 ; H01L21/48 ; C25D1/04 ; H05K3/02 ; H05K3/20 ; H01L23/498 ; H05K3/40 ; H05K3/42 ; C25D3/18 ; C25D3/38 ; C25D3/56 ; C25D3/58 ; C25D5/02 ; C25D5/10 ; C25D9/08
摘要：
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
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