Invention Grant
- Patent Title: System and process for chemical vapor deposition
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Application No.: US15376867Application Date: 2016-12-13
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Publication No.: US10337101B2Publication Date: 2019-07-02
- Inventor: Keith Daniel Humfeld , De'Andre James Cherry
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: MH2 Technology Law Group LLP
- Main IPC: C23C16/01
- IPC: C23C16/01 ; C23C16/26 ; C23C16/00 ; C23C16/40 ; C23C16/44 ; C23C16/455

Abstract:
A chemical vapor deposition method comprises flowing a carrier liquid through a reactor. A fluid comprising one or more reactants is introduced into the carrier liquid. The fluid is at a first temperature and first pressure and is sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid. Each of the microreactors comprise a discrete volume of the fluid and have a surface boundary defined by an interface of the fluid with the carrier liquid. The fluid is heated and optionally pressurized to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products. The plurality of chemical vapor deposition products are separated from the carrier liquid. A system for carrying out the method of the present disclosure is also taught.
Public/Granted literature
- US20180163297A1 SYSTEM AND PROCESS FOR CHEMICAL VAPOR DEPOSITION Public/Granted day:2018-06-14
Information query
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