Invention Grant
- Patent Title: Light-emitting diode structure, transfer assembly, and transfer method using the same
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Application No.: US15853778Application Date: 2017-12-23
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Publication No.: US10355166B2Publication Date: 2019-07-16
- Inventor: Tak Jeung , Won-Sik Choi , Jun-Beom Park , Jong-Hyeob Baek
- Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE
- Applicant Address: KR
- Assignee: KOREA PHOTONICS TECHNOLOGY INSTITUTE
- Current Assignee: KOREA PHOTONICS TECHNOLOGY INSTITUTE
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2016-0034445 20160323
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R31/26 ; H01L33/00 ; H01L33/36 ; H01L25/075 ; H01L33/06 ; H01L33/32 ; H01L33/62 ; H01L33/44
Abstract:
The present invention is intended to provide a light-emitting diode (LED) structure which can be easily transferred onto another substrate, a transfer assembly whose adhesive strength with LED structures can be maintained in spite of repetitive transfer processes, LED structures and a transfer assembly for selectively transferring the LED structures, and a transfer method using the same.
Public/Granted literature
- US20180204973A1 LIGHT-EMITTING DIODE STRUCTURE, TRANSFER ASSEMBLY, AND TRANSFER METHOD USING THE SAME Public/Granted day:2018-07-19
Information query
IPC分类:
