公开(公告)号：US10355166B2

公开(公告)日：2019-07-16

申请号：US15853778

申请日：2017-12-23

Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE

Inventor： Tak Jeung ,  Won-Sik Choi ,  Jun-Beom Park ,  Jong-Hyeob Baek

IPC: H01L21/66 ,  G01R31/26 ,  H01L33/00 ,  H01L33/36 ,  H01L25/075 ,  H01L33/06 ,  H01L33/32 ,  H01L33/62 ,  H01L33/44

Abstract: The present invention is intended to provide a light-emitting diode (LED) structure which can be easily transferred onto another substrate, a transfer assembly whose adhesive strength with LED structures can be maintained in spite of repetitive transfer processes, LED structures and a transfer assembly for selectively transferring the LED structures, and a transfer method using the same.