- Patent Title: Land grid array (LGA) packaging of passive-on-glass (POG) structure
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Application No.: US15233906Application Date: 2016-08-10
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Publication No.: US10361149B2Publication Date: 2019-07-23
- Inventor: Chengjie Zuo , Mario Francisco Velez , Changhan Hobie Yun , David Francis Berdy , Daeik Daniel Kim , Jonghae Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lo
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/15 ; H01L23/31 ; H01L23/14 ; H01L23/00 ; H05K1/02 ; H01L23/64 ; H05K3/34

Abstract:
A device includes a passive-on-glass (POG) structure and an interface layer. The POG structure includes a passive component and at least one contact pad on a first surface of a glass substrate. The interface layer has a second surface on the first surface of the glass substrate such that the passive component and the at least one contact pad are located between the first surface of the glass substrate and the interface layer. The interface layer includes at least one land grid array (LGA) pad formed on a third surface of the interface layer, where the third surface of the interface layer is opposite the second surface of the interface layer. The interface layer also includes at least one via formed in the interface layer configured to electrically connect the at least one contact pad with the at least one LGA pad.
Public/Granted literature
- US20180047660A1 LAND GRID ARRAY (LGA) PACKAGING OF PASSIVE-ON-GLASS (POG) STRUCTURE Public/Granted day:2018-02-15
Information query
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