Invention Grant
- Patent Title: Lead-free solder and electronic component built-in module
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Application No.: US14862607Application Date: 2015-09-23
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Publication No.: US10362686B2Publication Date: 2019-07-23
- Inventor: Tsutomu Yasui , Hisayuki Abe , Kenichi Kawabata , Tomoko Kitamura
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-017145 20100128
- Main IPC: C22C19/03
- IPC: C22C19/03 ; C22C13/00 ; B23K35/30 ; B23K35/26 ; B23K35/02 ; B32B15/01 ; H05K3/34
Abstract:
First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.
Public/Granted literature
- US20160008930A1 LEAD-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE Public/Granted day:2016-01-14
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