Invention Grant
- Patent Title: Coating electronic component
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Application No.: US15415493Application Date: 2017-01-25
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Publication No.: US10392704B2Publication Date: 2019-08-27
- Inventor: Kenichi Yoshida , Yuhei Horikawa , Atsushi Sato , Hisayuki Abe
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-163128 20100720
- Main IPC: C23C18/42
- IPC: C23C18/42 ; C23C18/16 ; C23C18/32 ; C23C18/54 ; C23C28/02 ; H01L23/00

Abstract:
A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.
Public/Granted literature
- US20170130337A1 COATING AND ELECTRONIC COMPONENT Public/Granted day:2017-05-11
Information query
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