公开(公告)号：US11516951B2

公开(公告)日：2022-11-29

申请号：US16876583

申请日：2020-05-18

申请人： TDK CORPORATION

发明人： Takashi Yamada ,  Atsushi Sato ,  Makoto Orikasa ,  Hideharu Moro

IPC分类号： H01L23/552 ,  H05K9/00

摘要： A noise suppression sheet comprises at least one composite layer, the composite layer including: an insulating resin layer; a non-magnetic metal layer formed on the insulating resin layer; and a metal magnetic layer formed on the non-magnetic metal layer, and the composite layer has a through hole. When the noise suppression sheet comprises a plurality of composite layers, the through holes are misaligned in adjacent composite layers in the laminating direction.

公开(公告)号：US11031330B2

公开(公告)日：2021-06-08

申请号：US16811018

申请日：2020-03-06

申请人： TDK CORPORATION

发明人： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC分类号： H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

摘要： An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US09472344B2

公开(公告)日：2016-10-18

申请号：US14918903

申请日：2015-10-21

申请人： TDK CORPORATION

发明人： Tomoyoshi Fujimura ,  Atsushi Sato ,  Masahiro Mori

IPC分类号： H01G4/06 ,  H05K7/00 ,  H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H05K1/18 ,  H01G4/248 ,  H05K1/11

CPC分类号： H01G4/30 ,  H01G2/06 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/11 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic component includes a multilayer capacitor and an interposer. The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate having first and second principal faces, a pair of first electrodes disposed on the first principal face, and a pair of second electrodes disposed on the second principal face so as to be separated from the pair of first electrodes in a first direction or in a second direction. Widths of the pair of external electrodes and the pair of first electrodes are smaller than a width of the element body. The element body has a first portion covered by the external electrode, and a pair of second portions located on both sides of the first portion. The pair of second portions are separated from the interposer and overlap the pair of second electrodes when viewed from a third direction.

摘要翻译： 电子部件包括多层电容器和内插器。 多层电容器包括元件体和一对外部电极。 插入器包括具有第一和第二主面的衬底，设置在第一主面上的一对第一电极和设置在第二主面上的一对第二电极，以与第一电极的第一电极分离 方向或第二方向。 一对外部电极和一对第一电极的宽度小于元件主体的宽度。 元件主体具有由外部电极覆盖的第一部分和位于第一部分两侧的一对第二部分。 当从第三方向观察时，该对第二部分与插入器分离并与该对第二电极重叠。

公开(公告)号：US11869834B2

公开(公告)日：2024-01-09

申请号：US17314187

申请日：2021-05-07

申请人： TDK CORPORATION

发明人： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC分类号： H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

CPC分类号： H01L23/49838 ,  G06F3/044 ,  H01L21/4857 ,  H01L23/49866 ,  H01L33/62 ,  H05K1/09 ,  H05K3/4007 ,  H01L2933/0066 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2203/04

摘要： An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US11765874B2

公开(公告)日：2023-09-19

申请号：US16932046

申请日：2020-07-17

申请人： TDK CORPORATION

发明人： Takashi Yamada ,  Miyuki Yanagida ,  Atsushi Sato ,  Kenichi Kawabata

IPC分类号： C25D3/56 ,  H05K9/00 ,  C25D7/00

CPC分类号： H05K9/0083 ,  C25D3/562 ,  H05K9/0088 ,  C25D7/001

摘要： A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

公开(公告)号：US10392704B2

公开(公告)日：2019-08-27

申请号：US15415493

申请日：2017-01-25

申请人： TDK CORPORATION

发明人： Kenichi Yoshida ,  Yuhei Horikawa ,  Atsushi Sato ,  Hisayuki Abe

IPC分类号： C23C18/42 ,  C23C18/16 ,  C23C18/32 ,  C23C18/54 ,  C23C28/02 ,  H01L23/00

摘要： A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.

公开(公告)号：US09655246B2

公开(公告)日：2017-05-16

申请号：US15007617

申请日：2016-01-27

申请人： TDK CORPORATION

发明人： Masahiro Mori ,  Atsushi Sato ,  Tomoyoshi Fujimura

IPC分类号： H05K1/18 ,  H01G4/30 ,  H01G4/228 ,  H01G4/012 ,  H05K1/02 ,  H05K1/11 ,  H01G4/224 ,  H05K3/34

CPC分类号： H05K1/181 ,  H01G2/065 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0298 ,  H05K1/11 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic component includes a multilayer capacitor and an interposer The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate, a pair of first electrodes, and is pair of second electrodes. The substrate includes first and second principal faces. The pair of first electrodes are disposed on the first principal face. The pair of second electrodes are disposed on the second principal thee. The element body includes a first portion and a pair of second portions. The first portion is covered by the external electrodes. The pair of second portions are located on both sides or the first portion and separated from the interposer. A width in a second direction of the pair of external electrodes is smaller than a width in the second direction of the element body and larger than a width in the second direction of the second portion.

公开(公告)号：US11410855B2

公开(公告)日：2022-08-09

申请号：US16997092

申请日：2020-08-19

申请人： TDK CORPORATION

发明人： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC分类号： H01L21/48 ,  G03F7/00 ,  H01L33/62 ,  C23C18/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  H01L23/00 ,  C23C18/38 ,  H01L25/075

摘要： A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US11613100B2

公开(公告)日：2023-03-28

申请号：US16876560

申请日：2020-05-18

申请人： TDK CORPORATION

发明人： Takashi Yamada ,  Atsushi Sato ,  Makoto Orikasa

IPC分类号： B32B15/01 ,  B32B7/025

摘要： A noise suppression sheet comprises a pair of metal magnetic layers and a non-magnetic metal layer interposed between the pair of metal magnetic layers, and can achieve high magnetic shield characteristics on both surfaces.

公开(公告)号：US11961652B2

公开(公告)日：2024-04-16

申请号：US16662220

申请日：2019-10-24

申请人： TDK CORPORATION

发明人： Hitoshi Ohkubo ,  Masazumi Arata ,  Kenichi Kawabata ,  Atsushi Sato

IPC分类号： H01F27/36 ,  H01F1/20 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32

CPC分类号： H01F27/2885 ,  H01F1/20 ,  H01F27/29 ,  H01F27/32 ,  H01F27/361

摘要： In a coil component, a shield layer is provided after the unevenness of the surface of an element body is smoothened by the surface being covered with an insulating layer. A Cu layer of the shield layer is provided on a smooth surface, and thus a thickness variation can be suppressed and the Cu layer can be formed with a substantially uniform thickness. In the coil component, a point where the shield layer is thin or a point lacking the shield layer is unlikely to be generated and a functional degradation of the shield layer is effectively suppressed.