Invention Grant
- Patent Title: Integrated electro-optical module assembly
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Application No.: US15821403Application Date: 2017-11-22
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Publication No.: US10393798B2Publication Date: 2019-08-27
- Inventor: Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent JoAnn Kealy Crockatt
- Main IPC: G01R31/309
- IPC: G01R31/309 ; G01R31/28 ; H05K3/34 ; H05K3/30 ; H05K3/00 ; H05K1/18 ; H05K1/11 ; H05K1/03 ; H05K1/02 ; H05K13/00

Abstract:
An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
Public/Granted literature
- US20180095125A1 INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY Public/Granted day:2018-04-05
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