Invention Grant
- Patent Title: Low temperature molybdenum film deposition utilizing boron nucleation layers
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Application No.: US15958568Application Date: 2018-04-20
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Publication No.: US10453744B2Publication Date: 2019-10-22
- Inventor: Shuang Meng , Richard Ulrich Assion , Thomas H. Baum , Bryan Clark Hendrix
- Applicant: Entegris, Inc.
- Applicant Address: US MA Billerica
- Assignee: ENTEGRIS, INC.
- Current Assignee: ENTEGRIS, INC.
- Current Assignee Address: US MA Billerica
- Agency: Entegris, Inc.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; C23C16/40 ; C23C16/02 ; H01L21/285 ; C23C16/455 ; H01L21/3205 ; C23C16/14 ; C23C16/28 ; H01L21/28

Abstract:
The disclosure relates to a method of making molybdenum films utilizing boron and molybdenum nucleation layers. The resulting molybdenum films have low electrical resistivity, are substantially free of boron, and can be made at reduced temperatures compared to conventional chemical vapor deposition processes that do not use the boron or molybdenum nucleation layers. The molybdenum nucleation layer formed by this process can protect the substrate from the etching effect of MoCl5 or MoOCl4, facilitates nucleation of subsequent CVD Mo growth on top of the molybdenum nucleation layer, and enables Mo CVD deposition at lower temperatures. The nucleation layer can also be used to control the grain sizes of the subsequent CVD Mo growth, and therefore controls the electrical resistivity of the Mo film.
Public/Granted literature
- US20180261503A1 LOW TEMPERATURE MOLYBDENUM FILM DEPOSITION UTILIZING BORON NUCLEATION LAYERS Public/Granted day:2018-09-13
Information query
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