Invention Grant
- Patent Title: Probe card
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Application No.: US16221611Application Date: 2018-12-17
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Publication No.: US10459007B2Publication Date: 2019-10-29
- Inventor: Chen-Yueh Kung , Wen-Yuan Chang , Wei-Cheng Chen
- Applicant: VIA Technologies, Inc.
- Applicant Address: TW New Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW102139998A 20131104
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G01R31/02 ; G01R31/26 ; G01R31/28 ; H01L21/66 ; H01L21/84

Abstract:
A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.
Public/Granted literature
- US20190120875A1 PROBE CARD Public/Granted day:2019-04-25
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