发明授权
- 专利标题： Copper electroplating compositions and methods of electroplating copper on substrates
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申请号： US16166198申请日： 2018-10-22
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公开(公告)号： US10533259B2公开(公告)日： 2020-01-14
- 发明人: Ravi Pokhrel
- 申请人： Rohm and Haas Electronic Materials LLC
- 申请人地址： US MA Marlborough
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人地址： US MA Marlborough
- 代理商 John J. Piskorski
- 主分类号： H01L21/445
- IPC分类号： H01L21/445 ; C25D5/02 ; C25D3/38 ; C25D7/00 ; H01L21/027 ; H05K3/10 ; H05K3/18 ; H05K3/40 ; H01L23/00 ; H01L21/768 ; H01L21/288 ; C25D5/10 ; C25D7/12 ; H05K1/09 ; H01L23/532
摘要：
Copper electroplating compositions which include an imidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
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