Invention Grant
- Patent Title: Apparatus and method for treating substrate
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Application No.: US15627618Application Date: 2017-06-20
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Publication No.: US10541161B2Publication Date: 2020-01-21
- Inventor: Younghun Jung , Choongki Min , Soo Hyun Cho
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-Do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: KR10-2016-0079248 20160624
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/67 ; B05D1/36

Abstract:
Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a support unit provided to support the substrate and rotate the substrate; a treatment liquid nozzle for supplying the treatment liquid onto the substrate supported by the support unit; a pre-wet liquid nozzle for supplying a pre-wet liquid onto a substrate supported by the support unit; and a controller for controlling the treatment liquid nozzle and the pre-wet liquid nozzle, wherein the controller controls the treatment liquid nozzle and the pre-wet liquid nozzle to perform a pre-wet step for supplying the pre-wet liquid to the substrate, and then a treatment liquid supply step for supplying the treatment liquid to the substrate and supplying the pre-wet liquid to the substrate during the supplying the treatment liquid to the substrate.
Public/Granted literature
- US20170372922A1 APPARATUS AND METHOD FOR TREATING SUBSTRATE Public/Granted day:2017-12-28
Information query
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