公开(公告)号：US11557477B2

公开(公告)日：2023-01-17

申请号：US16896535

申请日：2020-06-09

Applicant: SEMES CO., LTD.

Inventor： Min Jung Park ,  Kyungjin Seo ,  Younghun Jung

IPC: H01L21/033 ,  H01L21/67 ,  B01J35/00

Abstract: An apparatus for treating a substrate includes a heat treatment chamber having an interior space, a housing that is provided in the interior space and that has a treatment space therein, a gas supply line that supplies, into the treatment space, a hydrophobic gas for hydrophobicizing the substrate, and a decomposition unit that decomposes an alkaline gas leaking from the treatment space to the interior space.

公开(公告)号：US10541161B2

公开(公告)日：2020-01-21

申请号：US15627618

申请日：2017-06-20

Applicant: SEMES CO., LTD.

Inventor： Younghun Jung ,  Choongki Min ,  Soo Hyun Cho

IPC: H01L21/027 ,  H01L21/67 ,  B05D1/36

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a support unit provided to support the substrate and rotate the substrate; a treatment liquid nozzle for supplying the treatment liquid onto the substrate supported by the support unit; a pre-wet liquid nozzle for supplying a pre-wet liquid onto a substrate supported by the support unit; and a controller for controlling the treatment liquid nozzle and the pre-wet liquid nozzle, wherein the controller controls the treatment liquid nozzle and the pre-wet liquid nozzle to perform a pre-wet step for supplying the pre-wet liquid to the substrate, and then a treatment liquid supply step for supplying the treatment liquid to the substrate and supplying the pre-wet liquid to the substrate during the supplying the treatment liquid to the substrate.

公开(公告)号：US20230213283A1

公开(公告)日：2023-07-06

申请号：US18147524

申请日：2022-12-28

Applicant: Semes Co., Ltd.

Inventor： Juyeon CHO ,  Youngjun Lee ,  Kwangsoo Kim ,  Kisang Eum ,  Wooram Lee ,  Jongwha Kang ,  Younghun Jung ,  Junghyun Lee ,  Dongwoon Park ,  Sunwook Jung

IPC: F27B17/00 ,  H01L21/67 ,  F27D5/00 ,  F27D1/18 ,  F27D17/00 ,  F27D9/00

CPC classification number: F27B17/0025 ,  H01L21/67103 ,  F27D5/0037 ,  F27D1/1858 ,  F27D17/001 ,  F27D9/00 ,  F27D2009/007

Abstract: A substrate processing apparatus includes a bake chamber, a chamber door that opens and closes an opening of the bake chamber, a first support plate in the bake chamber, a first partition wall, which partitions a space provided on the first support plate into first heat treatment spaces spaced apart from each other in a first horizontal direction, and extends in a second horizontal direction and a vertical direction, first heat treatment modules arranged in the first heat treatment spaces, a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces, a first sealing bracket coupled to the first exhaust duct, a first horizontal packing configured to seal a gap between the first sealing bracket and the chamber door, and a first vertical packing configured to seal a gap between the first partition wall and the chamber door.

公开(公告)号：US10682674B2

公开(公告)日：2020-06-16

申请号：US15796415

申请日：2017-10-27

Applicant: SEMES CO., LTD.

Inventor： Younghun Jung ,  Chang Uk Park

IPC: B08B3/10 ,  B08B11/02 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  B05B9/00 ,  B05C11/10 ,  B08B3/08 ,  C11D11/00 ,  H01L21/02 ,  B08B3/02

Abstract: Embodiments of the inventive concept relate to an apparatus and a method for removing a liquid residing on a substrate. The substrate treating apparatus includes a substrate support unit configured to support the substrate, a liquid supply unit configured to supply a liquid onto the substrate supported by the substrate support unit, and a heating unit configured to heat the substrate supported by the substrate support unit, wherein the substrate support unit includes a support plate having a seating surface, on which the substrate is seated, and having a suction hole on the seating surface, a rotary shaft configured to rotate the support plate, and a vacuum member configured to reduce a pressure of the suction hole such that the substrate seated on the seating surface is vacuum-suctioned on the support plate. Accordingly, the drying efficiency of the substrate may be increased.