公开(公告)号：US11380560B2

公开(公告)日：2022-07-05

申请号：US16396982

申请日：2019-04-29

申请人： SEMES CO., LTD.

发明人： Ki Seung Lee ,  Choongki Min ,  Soo Hyun Cho ,  Okseong Lee

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687

摘要： The inventive concept relates to an apparatus and method for forming a film on a substrate by spin coating. The apparatus includes liquid dispensing units that dispense processing liquids to form liquid films on the first and second substrates, respectively, air-flow supply units that form downward air flows in the first and second spaces, respectively, and a controller that controls the liquid dispensing units and the air-flow supply units. Each of the liquid dispensing units includes a pre-treatment nozzle that dispenses a pre-treatment liquid and a coating solution nozzle that dispenses a coating solution onto a corresponding one of the first and second substrates. The controller controls the liquid dispensing units to dispense the pre-treatment liquids and thereafter the coating solutions onto the first and second substrates and adjusts supply states of the downward air flows according to amounts of the pre-treatment liquids dispensed.

公开(公告)号：US10541161B2

公开(公告)日：2020-01-21

申请号：US15627618

申请日：2017-06-20

申请人： SEMES CO., LTD.

发明人： Younghun Jung ,  Choongki Min ,  Soo Hyun Cho

IPC分类号： H01L21/027 ,  H01L21/67 ,  B05D1/36

摘要： Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a support unit provided to support the substrate and rotate the substrate; a treatment liquid nozzle for supplying the treatment liquid onto the substrate supported by the support unit; a pre-wet liquid nozzle for supplying a pre-wet liquid onto a substrate supported by the support unit; and a controller for controlling the treatment liquid nozzle and the pre-wet liquid nozzle, wherein the controller controls the treatment liquid nozzle and the pre-wet liquid nozzle to perform a pre-wet step for supplying the pre-wet liquid to the substrate, and then a treatment liquid supply step for supplying the treatment liquid to the substrate and supplying the pre-wet liquid to the substrate during the supplying the treatment liquid to the substrate.

公开(公告)号：US11139184B2

公开(公告)日：2021-10-05

申请号：US16158950

申请日：2018-10-12

申请人： SEMES CO., LTD.

发明人： Ki Seung Lee ,  Soo Hyun Cho ,  Choongki Min

IPC分类号： H01L21/67 ,  H01L21/687 ,  H01L21/027 ,  F24C15/10

摘要： The inventive concept provides an apparatus and a method for heat-treating a substrate. The method includes a first treatment operation of spacing a substrate apart from a support plate provided with a heater to a first height in a state in which a treatment space, in which the substrate is treated, is closed and heating the substrate, a second treatment operation of, after the first treatment operation, lowering the substrate such that the substrate is located at a second height and heating the substrate, a third treatment operation of, after the second treatment operation, lifting the substrate such that the substrate is spaced apart from the support plate to be located at a third height and heating the substrate, and a fourth treatment operation of, after the third treatment operation, lowering the substrate such that the substrate is located at a fourth height and heating the substrate.

公开(公告)号：US10714352B2

公开(公告)日：2020-07-14

申请号：US15681347

申请日：2017-08-19

申请人： SEMES CO., LTD.

发明人： Min Jung Park ,  Jung Yul Lee ,  Hyun Hee Lee ,  Soo Hyun Cho

IPC分类号： H01L21/302 ,  H01L21/027 ,  H01L21/67 ,  H01L21/687 ,  F26B5/04 ,  H01L21/02 ,  H01L21/311 ,  H01L21/683 ,  H01L21/60 ,  H01L21/306

摘要： Disclosed are an apparatus and a method for treating a substrate. The method includes repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied, and the second speed is higher than the first speed.