Invention Grant
- Patent Title: Shielding in electronic assemblies
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Application No.: US15716757Application Date: 2017-09-27
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Publication No.: US10548249B2Publication Date: 2020-01-28
- Inventor: Scott Mokler , Timothy Swettlen , Kevin Byrd
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/18 ; H01L23/498 ; H05K3/34 ; H01L23/00

Abstract:
Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.
Public/Granted literature
- US20190098802A1 SHIELDING IN ELECTRONIC ASSEMBLIES Public/Granted day:2019-03-28
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