公开(公告)号：US20220181289A1

公开(公告)日：2022-06-09

申请号：US17113410

申请日：2020-12-07

Applicant: Intel Corporation

Inventor： Eng Huat Goh ,  Kyle Davidson ,  Min Suet Lim ,  Kevin Byrd ,  James Wade

IPC: H01L23/00 ,  H01L23/13 ,  H01L23/498 ,  H01L23/64 ,  H01L21/56

Abstract: An integrated circuit package may be fabricated by disposing an underfill material between an electronic substrate and an integrated circuit device through an opening in the electronic substrate. In one embodiment, an integrated circuit assembly may include an electronic substrate having a first surface and an opposing second surface, wherein the electronic substrate includes at least one opening extending from the first surface to the second surface. The integrated circuit assembly may further include an integrated circuit device, wherein the integrated circuit device is electrically attached to the electronic substrate with at least one interconnect, and an underfill material may be disposed between the first surface of the electronic substrate and the integrated circuit device, wherein a portion of the underfill material extends into the opening in the electronic substrate.

公开(公告)号：US20190098802A1

公开(公告)日：2019-03-28

申请号：US15716757

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Scott Mokler ,  Timothy Swettlen ,  Kevin Byrd

IPC: H05K9/00 ,  H05K1/18 ,  H05K3/34 ,  H01L23/498

Abstract: Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.

公开(公告)号：US10548249B2

公开(公告)日：2020-01-28

申请号：US15716757

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Scott Mokler ,  Timothy Swettlen ,  Kevin Byrd

IPC: H05K9/00 ,  H05K1/18 ,  H01L23/498 ,  H05K3/34 ,  H01L23/00

Abstract: Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.