公开(公告)号：US20190098802A1

公开(公告)日：2019-03-28

申请号：US15716757

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Scott Mokler ,  Timothy Swettlen ,  Kevin Byrd

IPC: H05K9/00 ,  H05K1/18 ,  H05K3/34 ,  H01L23/498

Abstract: Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.

公开(公告)号：US10548249B2

公开(公告)日：2020-01-28

申请号：US15716757

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Scott Mokler ,  Timothy Swettlen ,  Kevin Byrd

IPC: H05K9/00 ,  H05K1/18 ,  H01L23/498 ,  H05K3/34 ,  H01L23/00

Abstract: Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.