公开(公告)号：US10531575B2

公开(公告)日：2020-01-07

申请号：US16072367

申请日：2016-04-01

Applicant: INTEL CORPORATION

Inventor： Sandeep Sane ,  Timothy Swettlen

IPC: H05K3/40 ,  H05K3/34 ,  H01L23/498

Abstract: The systems and methods described herein are directed to using a plurality of interface elements (e.g., sockets) and/or stud-bump elements embedded into board substrates (e.g., a motherboard) to enable the interchange of variable configuration components (e.g., electronic components, chips, and the like) that are mounted on package substrates having ball grid arrays (BGAs). In some aspects, this interchange can be accomplished while leaving the pre-existing board substrate design and various peripheral system components of the board substrate unchanged.

公开(公告)号：US20190098802A1

公开(公告)日：2019-03-28

申请号：US15716757

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Scott Mokler ,  Timothy Swettlen ,  Kevin Byrd

IPC: H05K9/00 ,  H05K1/18 ,  H05K3/34 ,  H01L23/498

Abstract: Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.

公开(公告)号：US20190037683A1

公开(公告)日：2019-01-31

申请号：US15660481

申请日：2017-07-26

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Timothy Swettlen

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  G06F1/16

Abstract: Embodiments herein disclose techniques for electronic apparatuses including a printed circuit board (PCB) and an electromagnetic interference (EMI) shield for the PCB. An electronic apparatus may include a PCB with a plurality of layers including a ground layer. The PCB may include a cutout through the plurality of layers of the PCB. An EMI shield may be mounted to a bottom side of the PCB along an edge of the cutout, where the EMI shield may be coupled to the ground layer through an ohmic contact. The EMI shield may be flat. Other embodiments may also be described and claimed.

公开(公告)号：US10548249B2

公开(公告)日：2020-01-28

申请号：US15716757

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Scott Mokler ,  Timothy Swettlen ,  Kevin Byrd

IPC: H05K9/00 ,  H05K1/18 ,  H01L23/498 ,  H05K3/34 ,  H01L23/00

Abstract: Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.