Invention Grant
- Patent Title: Light emitting device
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Application No.: US16111239Application Date: 2018-08-24
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Publication No.: US10553763B2Publication Date: 2020-02-04
- Inventor: Yuichi Yamada , Motokazu Yamada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2015-249237 20151222
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/48 ; H01L33/50 ; H01L33/58 ; H01L33/62 ; H01L33/54 ; H01L33/60

Abstract:
A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.
Public/Granted literature
- US20180366617A1 LIGHT EMITTING DEVICE Public/Granted day:2018-12-20
Information query
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