- Patent Title: Arrays of elevationally-extending strings of memory cells having a stack comprising vertically-alternating insulative tiers and wordline tiers and horizontally-elongated trenches in the stacks
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Application No.: US16437781Application Date: 2019-06-11
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Publication No.: US10586807B2Publication Date: 2020-03-10
- Inventor: Zhiqiang Xie , Chris M. Carlson , Justin B. Dorhout , Anish A. Khandekar , Greg Light , Ryan Meyer , Kunal R. Parekh , Dimitrios Pavlopoulos , Kunal Shrotri
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L21/02 ; H01L27/11556 ; H01L21/28 ; H01L21/3213 ; H01L21/311 ; H01L27/11565 ; H01L27/11519

Abstract:
An array of elevationally-extending strings of memory cells comprises a vertical stack of alternating insulative tiers and wordline tiers. The wordline tiers have terminal ends corresponding to control-gate regions of individual memory cells. The control-gate regions individually comprise part of a wordline in individual of the wordline tiers. A charge-blocking region of the individual memory cells extends elevationally along the individual control-gate regions. Charge-storage material of the individual memory cells extends elevationally along individual of the charge-blocking regions. Channel material extends elevationally along the vertical stack. Insulative charge-passage material is laterally between the channel material and the charge-storage material. Elevationally-extending walls laterally separate immediately-laterally-adjacent of the wordlines. The walls comprise laterally-outer insulative material and silicon-containing material spanning laterally between the laterally-outer insulative material. The silicon-containing material comprises at least 30 atomic percent of at least one of elemental-form silicon or a silicon-containing alloy. Other aspects, including method, are also disclosed.
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