Invention Grant
- Patent Title: Packaging a sealed cavity in an electronic device
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Application No.: US15696245Application Date: 2017-09-06
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Publication No.: US10589986B2Publication Date: 2020-03-17
- Inventor: Adam Joseph Fruehling , Juan Alejandro Herbsommer , Simon Joshua Jacobs , Benjamin Stassen Cook , James F. Hallas , Randy Long
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michael A. Davis, Jr.; Charles A. Brill; Frank D. Cimino
- Main IPC: B81B7/00
- IPC: B81B7/00 ; H03L7/26 ; G01L7/08 ; G04F5/14 ; G01M3/32 ; G01L9/00
Abstract:
An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.
Public/Granted literature
- US20190071304A1 PACKAGING A SEALED CAVITY IN AN ELECTRONIC DEVICE Public/Granted day:2019-03-07
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