Invention Grant
- Patent Title: Wafer plate and mask arrangement for substrate fabrication
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Application No.: US15284241Application Date: 2016-10-03
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Publication No.: US10679883B2Publication Date: 2020-06-09
- Inventor: Terry Bluck , Aaron Zanetto , William Eugene Runstadler, Jr. , Terry Pederson
- Applicant: Intevac, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: INTEVAC, INC.
- Current Assignee: INTEVAC, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Womble Bond Dickinson (US) LLP
- Agent Joseph Bach, Esq.
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L21/677 ; H01L31/18 ; C23C16/04 ; H01L21/673 ; C23C14/04 ; C23C16/458 ; C23C14/50
Abstract:
A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.
Public/Granted literature
- US20170062258A1 WAFER PLATE AND MASK ARRANGEMENT FOR SUBSTRATE FABRICATION Public/Granted day:2017-03-02
Information query
IPC分类:
