公开(公告)号：US20240258087A1

公开(公告)日：2024-08-01

申请号：US18535774

申请日：2023-12-11

申请人： INTEVAC, INC.

发明人： Samuel D. Harkness, IV ,  Thomas P. Nolan ,  Jae Ha Choi ,  Alexander Vassilievich Demtchouk ,  Terry Bluck

IPC分类号： H01J37/34 ,  C23C14/35 ,  C23C14/50

CPC分类号： H01J37/3452 ,  C23C14/35 ,  C23C14/50 ,  H01J37/3423 ,  H01J2237/002 ,  H01J2237/332

摘要： Sputtering system having cylindrical target with sputtering material on exterior surface; magnet arrangement inside the cylindrical target, having first set of magnets arranged on straight row, each having first pole facing interior wall of the target and second pole facing away from the interior wall, second set having plurality of magnets arranged in obround shape around the first set, each magnet having first pole facing away from the interior wall and second pole facing the interior wall; a keeper plate between the first set of magnets and the second set of magnets, such that straight line passing through an axis connecting the first pole and the second pole of a magnet from the second set intercepts the keeper plate prior to reaching the interior wall; and a cover.

公开(公告)号：US20240194455A1

公开(公告)日：2024-06-13

申请号：US18537692

申请日：2023-12-12

申请人： INTEVAC, INC.

发明人： Thomas P. Nolan ,  Zachary Lyons ,  Uy Le

IPC分类号： H01J37/32

CPC分类号： H01J37/32449 ,  H01J37/32981

摘要： Method for operating a plasma processing system by setting first process recipes for first station specifying initial gas flow rate, a change point, and a subsequent gas flow rate; setting second process recipes for second station specifying second gas flow rate; setting an initial estimate for gas leakage from the first station into the second station through the transport opening; and calculating a gas flow change for the second station using the initial gas flow rate and the subsequent gas flow rate of the first station, and the initial estimate; executing plasma processing simultaneously in the first station and the second station according to the first process recipe, the second process recipe and the gas flow change.

公开(公告)号：US20240191341A1

公开(公告)日：2024-06-13

申请号：US18537523

申请日：2023-12-12

申请人： INTEVAC, INC.

发明人： Samuel D. Harkness, IV ,  Thomas P. Nolan ,  Stephen M. Daly ,  Jae Ha Choi ,  Zachary Lyons ,  Jim Sullivan ,  Mike Anthony ,  Todd Morimoto

IPC分类号： C23C14/35 ,  C23C14/50 ,  C23C14/56

CPC分类号： C23C14/352 ,  C23C14/50 ,  C23C14/568

摘要： A plasma chamber for physical vapor deposition, having an anode aperture shield that reduces the field of view to the substrate for deposition particles from the sputtering target. The anode aperture shield limits the deposition particles reaching the substrate to selected maximum angles from the vertical, and rejects particles approaching with a larger angle from the vertical. The node aperture shield is grounded and may be constructed of an upper plate and a lower plate spaced apart from the upper plate, wherein the upper plate may include perforations or may incorporate an electron filter.

公开(公告)号：US11897811B2

公开(公告)日：2024-02-13

申请号：US17589498

申请日：2022-01-31

申请人： INTEVAC, INC.

发明人： Terry Bluck ,  Wendell Thomas Blonigan

IPC分类号： C23C14/34 ,  C03C17/34 ,  C23C14/54 ,  C23C14/00 ,  C23C14/10 ,  C23C14/08 ,  C23C14/50 ,  C08J7/04 ,  C23C14/56 ,  H01J37/32 ,  B05D5/06 ,  B32B17/10 ,  C03C17/42 ,  G02B1/111 ,  G02B1/116

CPC分类号： C03C17/3417 ,  B05D5/063 ,  B32B17/10174 ,  C03C17/3441 ,  C03C17/3482 ,  C03C17/42 ,  C08J7/0423 ,  C23C14/0052 ,  C23C14/0089 ,  C23C14/081 ,  C23C14/10 ,  C23C14/3442 ,  C23C14/3464 ,  C23C14/505 ,  C23C14/548 ,  C23C14/568 ,  G02B1/111 ,  G02B1/116 ,  H01J37/32899 ,  C03C2217/734 ,  C03C2217/76

摘要： A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section without exposing the substrate carrier to atmosphere.

公开(公告)号：US20230274920A1

公开(公告)日：2023-08-31

申请号：US18110269

申请日：2023-02-15

申请人： INTEVAC, INC.

发明人： Terry Bluck ,  Samuel D. Harkness, IV ,  Tom Nolan

IPC分类号： H01J37/34 ,  H01J37/32

CPC分类号： H01J37/3405 ,  H01J37/3452 ,  H01J37/32761 ,  H01J37/3244 ,  H01J37/32623

摘要： A linear processing system having an entry loadlock, a first multi-pass processing chamber coupled to the entry loadlock, the first multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; a single-pass chamber coupled to the first multi-pass processing chamber and having a plurality of magnetron arrangements arranged along a carrier travel direction, the single-pass chamber configured to house multiple carriers arranged serially in a row and configured for a single-pass processing; a second multi-pass processing chamber coupled to the single-pass processing chamber, the second multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; and an exit loadlock chamber coupled to the second multi-pass processing chamber.

公开(公告)号：US11414748B2

公开(公告)日：2022-08-16

申请号：US16583165

申请日：2019-09-25

申请人： Intevac, Inc.

发明人： Terry Bluck

IPC分类号： H01L21/677 ,  C23C14/56 ,  C23C14/34 ,  C23C14/50 ,  H01L21/67

摘要： A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.

公开(公告)号：US10115617B2

公开(公告)日：2018-10-30

申请号：US15284450

申请日：2016-10-03

申请人： Intevac, Inc.

发明人： Terry Bluck ,  Vinay Shah ,  Alexandru Riposan

IPC分类号： H01L21/677 ,  H01L21/67 ,  H01L21/687

摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

公开(公告)号：US09633880B2

公开(公告)日：2017-04-25

申请号：US14477783

申请日：2014-09-04

申请人： Intevac, Inc.

发明人： Stuart Scollay

IPC分类号： H01L21/677 ,  G11B5/84 ,  H01L21/673

CPC分类号： H01L21/67742 ,  G11B5/8404 ,  H01L21/67346 ,  H01L21/67709 ,  H01L21/67748 ,  H01L21/67751 ,  H01L2221/67 ,  Y10S414/139

摘要： Disclosed is a substrate processing system with a magnetic conduit configuration to improve the movement of a substrate carrier within the system. The configuration specifically provides for safe, secure movement of a carrier between multiple levels of a substrate processing system by using magnetic conduits to redirect magnetic forces created by a linear motor, permitting the linear motor to be positioned outside of the system and in a location that will not interfere with the movement of the carrier.

公开(公告)号：US09583661B2

公开(公告)日：2017-02-28

申请号：US15073427

申请日：2016-03-17

申请人： Intevac, Inc.

发明人： Vinay Prabhakar ,  Babak Adibi

IPC分类号： H01L21/425 ,  C23C16/00 ,  H01L31/05 ,  H01L21/266 ,  H01L31/18 ,  H01L31/068 ,  H01L21/426 ,  H01J37/32

CPC分类号： H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

摘要： A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

摘要翻译： 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US09543114B2

公开(公告)日：2017-01-10

申请号：US14819402

申请日：2015-08-05

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

IPC分类号： G01N23/00 ,  H01J37/20 ,  H01J37/18 ,  H01J37/317

CPC分类号： H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

摘要： System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

摘要翻译： 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。