公开(公告)号：US20170062258A1

公开(公告)日：2017-03-02

申请号：US15284241

申请日：2016-10-03

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Aaron Zanetto ,  William Eugene Runstadler, JR. ,  Terry Pederson

IPC: H01L21/68 ,  H01L21/677 ,  H01L21/683

Abstract: A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.

Abstract translation: 一种用于在真空处理室中处理晶片的系统。 载体包括具有多个开口的框架，每个开口被配置为容纳一个晶片。 一种配置成在整个系统中传送多个载体的传送机构。 配置用于支撑晶片的多个晶片板。 一种用于将多个晶片板附接到每个载体的附接机构，其中每个晶片板附接到相应载体的下侧处的对应位置，使得位于晶片载体之一上的每个晶片是 定位在载体中的多个开口中的一个内。 掩模附着在载体中的多个开口中的一个的前侧上。 对准台在载体的开口下面支撑晶片板。 定位成同时对掩模和晶片进行成像的照相机。

公开(公告)号：US10679883B2

公开(公告)日：2020-06-09

申请号：US15284241

申请日：2016-10-03

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Aaron Zanetto ,  William Eugene Runstadler, Jr. ,  Terry Pederson

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/677 ,  H01L31/18 ,  C23C16/04 ,  H01L21/673 ,  C23C14/04 ,  C23C16/458 ,  C23C14/50

Abstract: A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.