Invention Grant
- Patent Title: Fin field effect transistor (finFET) device structure and method for forming the same
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Application No.: US15590418Application Date: 2017-05-09
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Publication No.: US10700181B2Publication Date: 2020-06-30
- Inventor: Wei-Han Huang , Wen-Yen Chen , Jing-Huei Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L29/78 ; H01L21/02 ; H01L21/22 ; H01L21/311 ; H01L21/3115 ; H01L21/38 ; H01L21/28 ; H01L29/423 ; H01L21/223

Abstract:
A FinFET device structure and method for forming the same are provided. The method includes forming a fin structure over a substrate and forming a dummy gate electrode over a middle portion of the fin structure. The method also includes forming a spacer layer on the dummy gate electrode and on the fin structure and performing a plasma doping process on the dummy gate electrode and on the spacer layer. The method further includes performing an annealing process, wherein the annealing process is performed by using a gas comprising oxygen, such that a doped region is formed in a portion of the fin structure, and the spacer layer is doped with oxygen after the annealing process.
Public/Granted literature
- US20180151695A1 FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2018-05-31
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