Invention Grant
- Patent Title: Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
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Application No.: US16182277Application Date: 2018-11-06
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Publication No.: US10707168B2Publication Date: 2020-07-07
- Inventor: Amruthavalli Pallavi Alur , Sri Ranga Sai Boyapati , Robert Alan May , Islam A. Salama , Robert L. Sankman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/492
- IPC: H01L23/492 ; H01L23/538 ; H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L21/48 ; H01L25/00 ; H01L25/18 ; H01L23/31 ; H01L21/66 ; H01L21/683 ; H01L25/11
Abstract:
An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.
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