- Patent Title: Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry
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Application No.: US16139816Application Date: 2018-09-24
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Publication No.: US10707211B2Publication Date: 2020-07-07
- Inventor: Cornel Bozdog , Abhilasha Bhardwaj , Byeung Chul Kim , Michael E. Koltonski , Gurtej S. Sandhu , Matthew Thorum
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L23/528 ; H01L23/522 ; H01L21/822
Abstract:
Integrated circuitry comprising an array comprises a plurality of conductive vias. Individual of the vias comprise an upper horizontal perimeter comprising opposing end portions. One of the opposing end portions comprises opposing straight sidewalls. The other of the opposing end portions comprises opposing curved sidewalls that join with the opposing straight sidewalls of the one opposing end portion. Other embodiments, including methods, are disclosed.
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