发明授权
- 专利标题： Wafer bow reduction
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申请号： US15649733申请日： 2017-07-14
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公开(公告)号： US10714338B2公开(公告)日： 2020-07-14
- 发明人: Peter Ward
- 申请人： Anvil Semiconductors Limited
- 申请人地址： GB Warwickshire
- 专利权人： ANVIL SEMICONDUCTORS LIMITED
- 当前专利权人： ANVIL SEMICONDUCTORS LIMITED
- 当前专利权人地址： GB Warwickshire
- 代理机构： Tarolli, Sundheim, Covell & Tummino LLP
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1ab07af
- 主分类号： C30B25/18
- IPC分类号： C30B25/18 ; H01L21/02 ; H01L29/739 ; H01L29/16 ; H01L29/66 ; H01L29/08 ; C30B25/02 ; C30B29/06 ; C30B29/36 ; H01L29/34 ; H01L29/78 ; H01L29/861
摘要：
We describe a method for reducing bow in a composite wafer comprising a silicon wafer and a silicon carbide layer grown on the silicon wafer. The method includes applying nitrogen atoms during the growth process of the silicon carbide layer on the silicon wafer so as to generate a compressive stress within the composite wafer.
公开/授权文献
- US20170323790A1 WAFER BOW REDUCTION 公开/授权日：2017-11-09
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