Invention Grant
- Patent Title: Composite structure
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Application No.: US15914620Application Date: 2018-03-07
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Publication No.: US10723893B2Publication Date: 2020-07-28
- Inventor: Jen-You Chu , Chia-Le Wu , Feng-Sheng Kao , Chin-Ping Huang , Yi-Chun Chen
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@fc8c9d2
- Main IPC: B32B27/14
- IPC: B32B27/14 ; C09D5/16 ; C09D129/04 ; C09D171/08 ; B32B27/36 ; B32B27/30 ; B32B27/28 ; C08G83/00 ; C09D7/65 ; C09D201/00

Abstract:
A composite structure is provided, which includes a support, an active layer wrapping the support, a dendrimer grafted to the active layer through covalent bondings, and a plurality of anti-fouling groups, wherein each of the anti-fouling groups is grafted to terminals of the dendrimer through covalent bondings. The terminals of the dendrimer include amino group, hydroxyl group, or thiol group.
Public/Granted literature
- US20180258295A1 COMPOSITE STRUCTURE Public/Granted day:2018-09-13
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