Invention Grant
- Patent Title: Light emitting device having heat dissipation terminal arranged on substrate
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Application No.: US16729319Application Date: 2019-12-28
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Publication No.: US10734563B2Publication Date: 2020-08-04
- Inventor: Takuya Nakabayashi , Akira Hori
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@41e94a45 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2dddeaed
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/64 ; H01L33/60 ; H01L33/32 ; H01L33/56 ; H01L33/50 ; H01L33/54 ; H01L33/62 ; H01L25/075

Abstract:
A light emitting device includes a substrate, a light emitting element and a light transmissive member. The substrate includes an insulating base material having a first main surface, a second main surface that is opposite from the first main surface, and a mounting surface that is adjacent to at least the second main surface, a pair of connection terminals disposed on the first main surface, a heat dissipation terminal disposed on the second main surface, and having a narrow part and a wide part with a width of the wide part being wider than a width of the narrow part, and a pair of vias connecting the connection terminals and the heat dissipation terminal. The light emitting element has a pair of electrodes which connect to element connection sections of the pair of connection terminals. The light transmissive member is disposed on an upper surface of the light emitting element.
Public/Granted literature
- US20200136002A1 LIGHT EMITTING DEVICE Public/Granted day:2020-04-30
Information query
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