- 专利标题： Systems of applying materials to components
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申请号： US16114687申请日： 2018-08-28
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公开(公告)号： US10741519B2公开(公告)日： 2020-08-11
- 发明人: Jason L. Strader , Michael S. Wladyka , Keith David Johnson , Jingting Yang , Kevin Joel Bohrer , Mark D. Kittel
- 申请人： Laird Technologies, Inc.
- 申请人地址： US MO Chesterfield
- 专利权人： Laird Technologies, Inc.
- 当前专利权人： Laird Technologies, Inc.
- 当前专利权人地址： US MO Chesterfield
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 代理商 Anthony G. Fussner
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/67 ; H01L23/552 ; H01L23/373 ; H01L23/367 ; B32B38/00 ; B32B38/06 ; B32B37/00 ; H01L21/48 ; B23P15/26 ; H01L21/683 ; H01L31/0203 ; B23P15/20
摘要：
A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.