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公开(公告)号:US10741519B2
公开(公告)日:2020-08-11
申请号:US16114687
申请日:2018-08-28
发明人: Jason L. Strader , Michael S. Wladyka , Keith David Johnson , Jingting Yang , Kevin Joel Bohrer , Mark D. Kittel
IPC分类号: H01L23/00 , H01L21/67 , H01L23/552 , H01L23/373 , H01L23/367 , B32B38/00 , B32B38/06 , B32B37/00 , H01L21/48 , B23P15/26 , H01L21/683 , H01L31/0203 , B23P15/20
摘要: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.
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公开(公告)号:USD879046S1
公开(公告)日:2020-03-24
申请号:US29621364
申请日:2017-10-06
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