公开(公告)号：US11014203B2

公开(公告)日：2021-05-25

申请号：US15207444

申请日：2016-07-11

申请人： Laird Technologies, Inc.

发明人： Mark D. Kittel ,  Jason L. Strader

IPC分类号： H01L21/67 ,  H05K7/20 ,  B23P15/26 ,  H01L23/42 ,  H01L21/48 ,  B29C63/02 ,  H01L23/00 ,  B29C63/00 ,  C07C323/00 ,  C08L53/02 ,  H01L27/146 ,  B23K20/18

摘要： A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.

公开(公告)号：US20180009072A1

公开(公告)日：2018-01-11

申请号：US15207444

申请日：2016-07-11

申请人： Laird Technologies, Inc.

发明人： Mark D. Kittel ,  Jason L. Strader

IPC分类号： B23P15/26 ,  H05K7/20

CPC分类号： B23P15/26 ,  B29C63/0013 ,  B29C63/02 ,  H01L21/4803 ,  H01L21/4882 ,  H01L23/42 ,  H01L24/743 ,  H01L2224/27436 ,  H01L2224/32245 ,  H01L2224/83192 ,  H05K7/2039

摘要： Disclosed are exemplary embodiments of systems and methods of applying thermal interface materials (TIMs). The thermal interface materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.

公开(公告)号：USD999405S1

公开(公告)日：2023-09-19

申请号：US29728991

申请日：2020-03-23

申请人： Laird Technologies, Inc.

设计人： Michael S. Wladyka ,  Keith David Johnson ,  Jason L. Strader ,  Mark D. Kittel ,  Jingting Yang

摘要： FIG. 1 is a perspective view of a material having edging showing our new design;
FIG. 2 is a cross-sectional perspective view of the material having edging, taken along lines 2-2 in FIG. 1;
FIG. 3 is a top plan view of the material having edging shown in FIG. 1;
FIG. 4 is a front elevation view of the material having edging shown in FIG. 1;
FIG. 5 is a rear elevation view of the material having edging shown in FIG. 1;
FIG. 6 is a right side plan view of the material having edging shown in FIG. 1; and,
FIG. 7 is a left side plan view of the material having edging shown in FIG. 1.
The evenly spaced broken lines in FIGS. 1 through 7 represent portions of the material having edging and form no part of the claimed design. The material having edging is shown with a symbolic break in its length and width. The appearance of any portion of the material having edging between the break lines forms no part of the claimed design.

公开(公告)号：US10741519B2

公开(公告)日：2020-08-11

申请号：US16114687

申请日：2018-08-28

申请人： Laird Technologies, Inc.

发明人： Jason L. Strader ,  Michael S. Wladyka ,  Keith David Johnson ,  Jingting Yang ,  Kevin Joel Bohrer ,  Mark D. Kittel

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L23/552 ,  H01L23/373 ,  H01L23/367 ,  B32B38/00 ,  B32B38/06 ,  B32B37/00 ,  H01L21/48 ,  B23P15/26 ,  H01L21/683 ,  H01L31/0203 ,  B23P15/20

摘要： A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.

公开(公告)号：USD879046S1

公开(公告)日：2020-03-24

申请号：US29621364

申请日：2017-10-06

申请人： Laird Technologies, Inc.

设计人： Michael S. Wladyka ,  Keith David Johnson ,  Jason L. Strader ,  Mark D. Kittel ,  Jingting Yang

公开(公告)号：US12040306B2

公开(公告)日：2024-07-16

申请号：US16988919

申请日：2020-08-10

申请人： Laird Technologies, Inc.

发明人： Jason L. Strader ,  Michael S. Wladyka ,  Keith David Johnson ,  Jingting Yang ,  Kevin Joel Bohrer ,  Mark D. Kittel

IPC分类号： H01L21/67 ,  B32B37/00 ,  B32B38/00 ,  B32B38/06 ,  H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/552 ,  B23P15/20 ,  B23P15/26 ,  H01L21/683 ,  H01L31/0203

CPC分类号： H01L24/743 ,  B32B37/025 ,  B32B38/0004 ,  B32B38/06 ,  H01L21/4882 ,  H01L21/67132 ,  H01L23/3675 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/27 ,  H01L24/97 ,  B23P15/20 ,  B23P15/26 ,  B32B2457/00 ,  H01L21/6835 ,  H01L24/73 ,  H01L31/0203 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/32245 ,  H01L2224/83192 ,  Y10T29/53178 ,  Y10T29/53265

摘要： A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.

公开(公告)号：USD998827S1

公开(公告)日：2023-09-12

申请号：US29731731

申请日：2020-04-17

申请人： Laird Technologies, Inc.

设计人： Michael S. Wladyka ,  Keith David Johnson ,  Jason L. Strader ,  Mark D. Kittel ,  Jingting Yang

摘要： FIG. 1 is a perspective view of a material having edge shape showing our new design;
FIG. 2 is a cross-sectional perspective view of the material having edge shape of FIG. 1, taken along lines 2-2 in FIG. 1;
FIG. 3 is a front elevation view of the material having edge shape of FIG. 1;
FIG. 4 is a rear elevation view of the material having edge shape of FIG. 1;
FIG. 5 is a top plan view of the material having edge shape of FIG. 1;
FIG. 6 is a right side elevation view of the material having edge shape of FIG. 1; and,
FIG. 7 is a left side elevation view of the material having edge shape of FIG. 1.
The evenly spaced broken lines in FIGS. 1 through 7 represent portions of the material having edge shape and form no part of the claimed design. The material having edge shape is shown with a symbolic break in its length and width. The appearance of any portion of the material having edge shape between the break lines forms no part of the claimed design.