发明授权
- 专利标题: Photomask
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申请号: US15986799申请日: 2018-05-22
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公开(公告)号: US10747099B2公开(公告)日: 2020-08-18
- 发明人: Yen-Pu Chen , Shu-Yen Liu , Tang-Chun Weng , Tuan-Yen Yu
- 申请人: UNITED MICROELECTRONICS CORP.
- 申请人地址: TW Hsin-Chu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu
- 主分类号: G03F1/38
- IPC分类号: G03F1/38 ; G03F1/54 ; G03F1/50 ; H01L21/027
摘要:
The present invention provides a photomask, comprising: a substrate, a first region, a second region and a third region are defined thereon, wherein the third region is disposed between the first region and the second region, a patterned layer disposed on the substrate, wherein the patterned layer comprises a first patterned layer disposed in the first region, a second patterned layer disposed in the second region, and a third patterned layer disposed in the third region, and wherein a thickness of the first patterned layer is equal to a thickness of the second patterned layer, the thickness of the first patterned layer is different from a thickness of the third patterned layer, and at least one recess disposed in the third region.
公开/授权文献
- US20190361339A1 PHOTOMASK 公开/授权日:2019-11-28
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