Invention Grant
- Patent Title: Thermally conductive resin, resin composition, prepreg, and copper clad laminate
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Application No.: US15856514Application Date: 2017-12-28
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Publication No.: US10752744B2Publication Date: 2020-08-25
- Inventor: Feng-Po Tseng , Wen-Pin Ting , Kuo-Chan Chiou
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE , ITEQ CORPORATION
- Applicant Address: TW Hsinchu TW Xinpu Township
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE,ITEQ CORPORATION
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE,ITEQ CORPORATION
- Current Assignee Address: TW Hsinchu TW Xinpu Township
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19cd1d58
- Main IPC: C08J5/24
- IPC: C08J5/24 ; C08G61/10 ; C08K5/25 ; C08K5/14 ; C08K5/17 ; C08K5/23 ; B32B33/00 ; C08F212/34 ; C09D4/00 ; C08F220/20 ; C08L29/10 ; C08K5/00 ; C08K5/5415 ; H05K1/05 ; C08K5/3492
Abstract:
A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(═O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.
Public/Granted literature
- US20190194408A1 THERMALLY CONDUCTIVE RESIN, RESIN COMPOSITION, PREPREG, AND COPPER CLAD LAMINATE Public/Granted day:2019-06-27
Information query
