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公开(公告)号:US10752744B2
公开(公告)日:2020-08-25
申请号:US15856514
申请日:2017-12-28
发明人: Feng-Po Tseng , Wen-Pin Ting , Kuo-Chan Chiou
IPC分类号: C08J5/24 , C08G61/10 , C08K5/25 , C08K5/14 , C08K5/17 , C08K5/23 , B32B33/00 , C08F212/34 , C09D4/00 , C08F220/20 , C08L29/10 , C08K5/00 , C08K5/5415 , H05K1/05 , C08K5/3492
摘要: A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(═O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.