Invention Grant
- Patent Title: Method of manufacturing a chip component
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Application No.: US16231937Application Date: 2018-12-24
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Publication No.: US10763016B2Publication Date: 2020-09-01
- Inventor: Hiroshi Tamagawa , Hiroki Yamamoto , Katsuya Matsuura , Yasuhiro Kondo
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3935e46 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@11506ac3 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f337155 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@735f48c1 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6aa75982 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@78332067 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4c3e5fed com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@452e0feb com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@15152585
- Main IPC: H01C1/14
- IPC: H01C1/14 ; H01G5/38 ; H01G2/16 ; H01F27/40 ; H01F27/28 ; H01C10/50 ; H01C10/16 ; H01G5/011 ; H01L27/08 ; H01C17/00 ; H01C17/23 ; H05K3/34 ; H01L33/62 ; H01G4/38 ; H01G4/40 ; H01L25/10 ; H01L25/13 ; H01L27/15 ; H01G4/33 ; H01G5/40 ; H05K1/18 ; H01F29/08 ; H01F41/04 ; H01L23/00 ; H01F29/00 ; H01F17/00
Abstract:
A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.
Public/Granted literature
- US20190148040A1 METHOD OF MANUFACTURING A CHIP COMPONENT Public/Granted day:2019-05-16
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