Invention Grant
- Patent Title: Virtualized link states of multiple protocol layer package interconnects
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Application No.: US16373472Application Date: 2019-04-02
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Publication No.: US10776302B2Publication Date: 2020-09-15
- Inventor: Joon Teik Hor , Ting Lok Song , Mahesh Wagh , Su Wei Lim
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/38 ; G06F13/42 ; G06F13/16

Abstract:
Systems, methods, and devices can include a first die comprising a first arbitration and multiplexing logic, a first protocol stack associated with a first interconnect protocol, and a second protocol stack associated with a second interconnect protocol. A second die comprising a second arbitration and multiplexing logic. A multilane link connects the first die to the second die. The second arbitration and multiplexing logic can send a request to the first arbitration and multiplexing logic to change a first virtual link state associated with the first protocol stack. The first arbitration and multiplexing logic can receive, from across the multilane link, the request from the first die indicating a request to change the first virtual link state; determine that the first interconnect protocol is ready to change a physical link state; and change the first virtual link state according to the received request while maintaining a second virtual link state.
Public/Granted literature
- US20190227972A1 VIRTUALIZED LINK STATES OF MULTIPLE PROTOCOL LAYER PACKAGE INTERCONNECTS Public/Granted day:2019-07-25
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