- Patent Title: Copper foil with minimized bagginess, wrinkle or tear, electrode including the same, secondary battery including the same and method for manufacturing the same
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Application No.: US16126470Application Date: 2018-09-10
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Publication No.: US10787752B2Publication Date: 2020-09-29
- Inventor: Seung Min Kim , Jeong Gil Lee
- Applicant: KCF Technologies Co., Ltd.
- Applicant Address: KR Anyang-si, Gyeonggi-Do
- Assignee: KCF TECHNOLOGIES CO., LTD.
- Current Assignee: KCF TECHNOLOGIES CO., LTD.
- Current Assignee Address: KR Anyang-si, Gyeonggi-Do
- Agency: K&L Gates LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4c34c5eb
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D5/48 ; C25D5/16 ; H05K1/03 ; H05K3/42 ; C25D7/06 ; H05K3/02 ; H05K3/28 ; C25D1/04
Abstract:
Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 μm and a texture coefficient bias [TCB(220)] of 0.52 or less.
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